As enterprises and cloud providers grapple with growing volumes of data from AI training, analytics, and hyperscale services, traditional board-mounted connectors and cables are reaching their limits. CDFP (Composable Data Fabric Pluggable) connectors answer this challenge by delivering a standardized, high-density, pluggable I/O interface designed for data center and HPC environments. By supporting up to 400 Gbps per port over 16 lanes—and scalable to x8 or x4 configurations—CDFP unlocks the bandwidth needed for disaggregated compute, memory, storage, and accelerator fabrics.Get more news about CDFP Connector,you can vist our website!
The genesis of CDFP stems from collaborative industry efforts to define an open, multi-source form factor for pluggable PCIe interconnects. In 2013 the initial specifications were drafted to meet growing demand for external I/O solutions. Today CDFP is recognized by PCI-SIG for external cabling in both PCIe Gen 5 and Gen 6, and codified under SNIA’s SFF-TA-1032 standard. This broad ecosystem alignment ensures that hardware from multiple vendors—connectors, cages, cables, transceivers—interoperate seamlessly, shortening development cycles and lowering cost of ownership.
At the heart of CDFP’s capability is its electrical and mechanical design. Each CDFP port integrates 16 differential lanes, each capable of 25 Gbps PAM-4 signaling (yielding 400 Gbps total). The 85 Ω impedance-controlled interface includes sideband signals for management and lane-swap functions, while integrated EMI shielding and gasket options protect against noise in dense rack environments. To accommodate Gen 5 and Gen 6 footprints, CDFP can be supplied in press-fit or surface-mount (SMT) PCB terminations. Modular cage assemblies simplify board mounting and enable flip-up or belly-to-belly cable routing.
Beyond raw speed, CDFP connectors deliver a host of practical benefits. Their compact form factor maximizes port density on PCIe cards, server motherboards, and storage sleds. Removable cables and optical modules allow field-replaceable upgrades without system downtime. Backward compatibility ensures a smooth migration path: Gen 6 CDFP receptacles accept Gen 5 passive copper assemblies, and the ecosystem roadmap already anticipates Gen 7-rated partners. This flexibility empowers data center operators to right-size deployments for current needs while preserving capacity for future workloads.
Major interconnect suppliers such as TE Connectivity and Molex have built broad CDFP linecards, including passive copper, active copper, and optical cable assemblies. TE’s cage-and-connector system offers 120-position PCB mating interfaces for x16 channels and supports direct-attach copper up to five meters, multimode fiber to 100 m, and single-mode links to two kilometers. Molex extends CDFP to 64 Gbps PAM-4 capability—enabling a Gen 7 upgrade path—and bundles robust EMI shielding in a low-profile housing. These vendor offerings ensure that OEMs can select the optimal cable material, bend radius, and data rate for their specific thermal and density constraints.
CDFP’s architecture perfectly complements emerging disaggregated and composable data-center models. In pooled-memory fabrics (JBOM – Just a Bunch of Memory), CDFP links aggregate DRAM resources across compute islands. GPU and AI accelerator clusters (JBOG – Just a Bunch of GPUs) leverage CDFP to deliver high-throughput, low-latency connectivity to CPU head nodes. Storage arrays (JBOD/JBOF) and converged fabrics (CXL switching) likewise exploit CDFP’s bandwidth to streamline data movement. Even disaggregated NICs (JBON) use CDFP for external network interface cards, enabling hot-swappable, high-density networking.
Looking ahead, CDFP stands as a foundation for next-generation data-center interconnect architectures. As demands rise for multi-terabit fabrics, power-optimized signaling and integrated photonics will fold into the CDFP footprint. Standardization through PCI-SIG, SNIA, and hyperscale-driven consortia promises to broaden the ecosystem of cables, active modules, and optical engines. For any organization planning PCIe Gen 6 rollouts or exploring composable disaggregation, the CDFP connector system offers a proven, interoperable highway—ready to scale far beyond today’s 400 Gbps threshold.
